Simulation of RF fields for wood gluing applications
Allbwn ymchwil: Cyfraniad at gynhadledd › Papur › adolygiad gan gymheiriaid
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2017. Papur a gyflwynwyd yn 16th International Conference on Microwave and High Frequency Heating. AMPERE 2017, Delf, Yr Iseldiroedd.
Allbwn ymchwil: Cyfraniad at gynhadledd › Papur › adolygiad gan gymheiriaid
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TY - CONF
T1 - Simulation of RF fields for wood gluing applications
AU - Parker, Nyle
AU - Cuenca, J
AU - Dimitriou, Athanasios
AU - Ormondroyd, Graham
AU - Slocombe, Daniel
PY - 2017/9/21
Y1 - 2017/9/21
N2 - The important effect of the material loading of the parallel plate electric field applicator and its interactions with the established fields is demonstrated. A comparison is then established between the simulation and physical process. Field uniformity is very important to establish uniform heating of a material in batch processing. The applicator establishes a strong electric field between two separate electrodes and a ground plate. 15kV is applied to each electrode at 13.56 MHz by a RF Generator. In this work a simplified 2D model of a wood curing lamination system has developed in COMSOL Multipysics® using empirically dielectric property data. The result indicates that due to the higher dielectric loss of the adhesive compared to the wood, it results in the absorption of a much higher amount of energy, thus curing rapidly. Broadband permittivity measurements are taken of the dielectric materials. Simulated results compare well to the experimentally observed system.
AB - The important effect of the material loading of the parallel plate electric field applicator and its interactions with the established fields is demonstrated. A comparison is then established between the simulation and physical process. Field uniformity is very important to establish uniform heating of a material in batch processing. The applicator establishes a strong electric field between two separate electrodes and a ground plate. 15kV is applied to each electrode at 13.56 MHz by a RF Generator. In this work a simplified 2D model of a wood curing lamination system has developed in COMSOL Multipysics® using empirically dielectric property data. The result indicates that due to the higher dielectric loss of the adhesive compared to the wood, it results in the absorption of a much higher amount of energy, thus curing rapidly. Broadband permittivity measurements are taken of the dielectric materials. Simulated results compare well to the experimentally observed system.
M3 - Paper
T2 - 16th International Conference on Microwave and High Frequency Heating. AMPERE 2017
Y2 - 18 September 2017 through 21 September 2017
ER -