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Volatile organic compound (VOC) emissions from no-added-formaldehyde lignosulphonate/pMDI particleboards and their effect on indoor air quality. / Goncalves, Sofia; Curling, Simon; Ormondroyd, Graham et al.
In: Wood Material Science and Engineering, 18.09.2024, p. 1-9.

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Goncalves, S., Curling, S., Ormondroyd, G., Paiva, N., Martins, J., Magalhaes, F., & Carvalho, L. (2024). Volatile organic compound (VOC) emissions from no-added-formaldehyde lignosulphonate/pMDI particleboards and their effect on indoor air quality. Wood Material Science and Engineering, 1-9. Advance online publication. https://doi.org/10.1080/17480272.2024.2396431

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Goncalves S, Curling S, Ormondroyd G, Paiva N, Martins J, Magalhaes F et al. Volatile organic compound (VOC) emissions from no-added-formaldehyde lignosulphonate/pMDI particleboards and their effect on indoor air quality. Wood Material Science and Engineering. 2024 Sept 18;1-9. Epub 2024 Sept 18. doi: 10.1080/17480272.2024.2396431

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TY - JOUR

T1 - Volatile organic compound (VOC) emissions from no-added-formaldehyde lignosulphonate/pMDI particleboards and their effect on indoor air quality

AU - Goncalves, Sofia

AU - Curling, Simon

AU - Ormondroyd, Graham

AU - Paiva, Nadia

AU - Martins, Jorge

AU - Magalhaes, Fernao

AU - Carvalho, Luisa

PY - 2024/9/18

Y1 - 2024/9/18

N2 - Wood-based panels, for example particleboards, are responsible for releasing formaldehyde and volatile organic compounds (VOCs), consequently polluting indoor air. Thus, the demand for eco-friendly wood adhesives, such as lignosulphonates (LS), has increased in detriment of the traditionally used ureaformaldehyde resins. However, combination with polymeric 4,4′-diphenylmethane diisocyanate (pMDI) is commonly proposed to minimize pressing times. In this study, particleboards were manufactured using a low lab-scale press factor of 7.5 s/mm. The adhesive contents were: 1.3% pMDI with 2.2% propylene carbonate (PC) solvent in the core layer and 15% LS in the surface layers. The VOC emissions of these boards were evaluated against those of commercial urea-formaldehyde boards. Headspace gas chromatography-mass spectrometry analysis indicated that the total VOC emissions were 66% higher for the LS/pMDI boards, comprising mainly of PC and furfural. After 14-days in a 25 L chamber, VOC emissions were examined according to ISO 16000-9:2006. LS/pMDI particleboards emitted four times more VOCs than standard boards, with 80% corresponding to PC and furfural, a suspected carcinogen. Consequently, the need for VOC quantification, even for bio-based boards is highlighted. An extension of EN 16516:2017 + A1:2020 to furniture products is also advised.

AB - Wood-based panels, for example particleboards, are responsible for releasing formaldehyde and volatile organic compounds (VOCs), consequently polluting indoor air. Thus, the demand for eco-friendly wood adhesives, such as lignosulphonates (LS), has increased in detriment of the traditionally used ureaformaldehyde resins. However, combination with polymeric 4,4′-diphenylmethane diisocyanate (pMDI) is commonly proposed to minimize pressing times. In this study, particleboards were manufactured using a low lab-scale press factor of 7.5 s/mm. The adhesive contents were: 1.3% pMDI with 2.2% propylene carbonate (PC) solvent in the core layer and 15% LS in the surface layers. The VOC emissions of these boards were evaluated against those of commercial urea-formaldehyde boards. Headspace gas chromatography-mass spectrometry analysis indicated that the total VOC emissions were 66% higher for the LS/pMDI boards, comprising mainly of PC and furfural. After 14-days in a 25 L chamber, VOC emissions were examined according to ISO 16000-9:2006. LS/pMDI particleboards emitted four times more VOCs than standard boards, with 80% corresponding to PC and furfural, a suspected carcinogen. Consequently, the need for VOC quantification, even for bio-based boards is highlighted. An extension of EN 16516:2017 + A1:2020 to furniture products is also advised.

KW - Volatile Organic campounds

KW - Particleboard

U2 - 10.1080/17480272.2024.2396431

DO - 10.1080/17480272.2024.2396431

M3 - Article

SP - 1

EP - 9

JO - Wood Material Science and Engineering

JF - Wood Material Science and Engineering

SN - 1748-0272

ER -