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Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL).

Research output: Contribution to journal › Article › peer-review

Standard Standard

Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL). / Kettle, J.P.; Kettle, J.; Hoyle, R.T. et al.
In: Microelectronic Engineering, Vol. 85, No. 5-6, 01.05.2008, p. 853-855.

Research output: Contribution to journal › Article › peer-review

HarvardHarvard

Kettle, JP, Kettle, J, Hoyle, RT, Dimov, S & Perks, RM 2008, 'Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL).', Microelectronic Engineering, vol. 85, no. 5-6, pp. 853-855. https://doi.org/10.1016/j.mee.2007.12.003

APA

Kettle, J. P., Kettle, J., Hoyle, R. T., Dimov, S., & Perks, R. M. (2008). Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL). Microelectronic Engineering, 85(5-6), 853-855. https://doi.org/10.1016/j.mee.2007.12.003

CBE

Kettle JP, Kettle J, Hoyle RT, Dimov S, Perks RM. 2008. Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL). Microelectronic Engineering. 85(5-6):853-855. https://doi.org/10.1016/j.mee.2007.12.003

MLA

Kettle, J.P. et al. "Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL).". Microelectronic Engineering. 2008, 85(5-6). 853-855. https://doi.org/10.1016/j.mee.2007.12.003

VancouverVancouver

Kettle JP, Kettle J, Hoyle RT, Dimov S, Perks RM. Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL). Microelectronic Engineering. 2008 May 1;85(5-6):853-855. doi: 10.1016/j.mee.2007.12.003

Author

Kettle, J.P. ; Kettle, J. ; Hoyle, R.T. et al. / Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL). In: Microelectronic Engineering. 2008 ; Vol. 85, No. 5-6. pp. 853-855.

RIS

TY - JOUR

T1 - Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL).

AU - Kettle, J.P.

AU - Kettle, J.

AU - Hoyle, R.T.

AU - Dimov, S.

AU - Perks, R.M.

PY - 2008/5/1

Y1 - 2008/5/1

U2 - 10.1016/j.mee.2007.12.003

DO - 10.1016/j.mee.2007.12.003

M3 - Article

VL - 85

SP - 853

EP - 855

JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 0167-9317

IS - 5-6

ER -